Collection is open for research but is stored off-site and special arrangements must be made to work with it. Contact the Archives Center for information at [email protected] or 202-633-3270. Portions ...
Copper-copper bonding is emerging as a pivotal technology in three-dimensional integration, offering a viable pathway towards overcoming the limitations of traditional interconnect methods. By ...
*Many factors can affect the device thickness. Process optimizations might be necessary. Laser debonding results at 308 nm using BrewerBOND T1107 (2 µm) and BrewerBOND C1301-50 (60 µm) materials, with ...
-Aiming for mass production in FY2026 for real-world implementation in the fields of 6G communications and non-destructive sensing- OKI (TOKYO: 6703) , in collaboration with NTT Innovative Devices ...
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