Global Die-Attach Materials Market to Reach $834 Million by 2026 Die-attach also known as die bonding relates to the method of affixing a semiconductor die to a substrate (such as a PCB board), or to ...

QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...

Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...

Using a chip-first die attach process, this investigation will address die shift and deformation using various release and thermoplastic bonding materials. Combinations using different EMC products ...

High-power semiconductor applications currently represent one of the highest growth sectors of any semiconductor technology, specifically because many of the key applications are driven by the ...

The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...

Dublin, April 19, 2024 (GLOBE NEWSWIRE) -- The "Die-Attach Materials - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's offering. Global Die-Attach Materials Market ...

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LAB ID offers customized ultrahigh-frequency (UHF) RFID and Near Field Communication (NFC) tags, as well as dual-frequency RFID tags that combine both technologies. The company also provides services ...

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