Box Genie has launched its mobile 3D Design Studio, enabling businesses to create branded, professional packaging on the go with instant 360-degree previews. Kansas City, Missouri--(Newsfile Corp. - ...

SINGAPORE, July 9, 2025 /PRNewswire/ -- As digital transformation sweeps across the global packaging sector, Pacdora has emerged as a key force driving change. As a leading online 3D packaging design ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Innolux signed an agreement with Japan-based Tech Extension Co. (TEX) and Tech Extension Taiwan Co. (TEX-T) to introduce next-generation 3D packaging technologies based on Bumpless Build Cube (BBCube) ...

Luton, Bedfordshire, United Kingdom, July 18, 2024 (GLOBE NEWSWIRE) -- Exactitude Consultancy, the market research and consulting wing of Ameliorate Digital Consultancy Private Limited has completed ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications, according to industry ...

The power electronics industry and the semiconductor industry, inseparably intertwined with one another, are facing unprecedented efficiency, cost, construction and thermal challenges which provide ...

The PSMA (Power Sources Manufacturers Association) Packaging Committee announced that it has published a report titled "Current Developments in 3D Packaging With Focus on Embedded Substrate ...

If you are familiar with Moore’s Law, you’ve probably read pronouncements that the premise of transistor counts doubling each year is reaching a wall due to complex process technologies and device ...